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AB Electronic 80190-300-01-R PCB Assembly, High-Performance Circuit Board

The AB 80190-300-01-R PCB Assembly Module is a versatile, high-performance component designed for advanced industrial automation systems, ensuring reliable operation in demanding environments.

Material:High-grade FR-4 epoxy resin

Size:100mm x 100mm

Weight:200g

Operating Temperature Range:-40°C to +85°C

Power Consumption:15W

Communication Interface:RS-485

Data Transfer Rate:1 Mbps

Connectors:24-pin DIP socket

    Introducing the AB 80190-300-01-R PC Board Assembly, a cutting-edge solution for industrial control systems. This board is meticulously engineered for applications requiring high reliability and robustness in challenging environments. Crafted from high-grade FR-4 epoxy resin, it ensures durability and exceptional thermal stability.

    The assembly features a compact size of 100mm x 100mm, making it ideal for space-constrained industrial setups. Its lightweight design, weighing in at 200g, facilitates easy installation and maintenance without compromising on performance.

    With an operating temperature range from -40°C to +85°C, this board is designed to withstand extreme conditions, ensuring continuous operation in diverse industrial settings. It is capable of consuming up to 15W, providing sufficient power for demanding tasks while maintaining efficiency.

    Equipped with an RS-485 communication interface, the AB 80190-300-01-R supports high-speed data transfer rates of up to 1 Mbps, enabling seamless integration with other control systems and devices. This feature is crucial for applications requiring real-time data exchange and processing.

    For secure and reliable data connections, the board includes a 24-pin DIP socket, allowing for flexible connection options and compatibility with various components and peripherals. This ensures that the board can be seamlessly integrated into existing industrial control systems, enhancing their functionality and efficiency.

AB 80190-300-01-R PC BOARD ASSEMBLY




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